LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.

Our Partnership

ASU is currently at the forefront of advanced semiconductor packaging research and scale-up, and its newly announced Advanced Packaging Piloting Facility (PPF) created via the CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) will enable researchers and industry leaders to test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. LQDX will provide ASU with its Liquid Metal Ink (LMI_x®) chemistries and process IP and will collaborate with sponsored students and industry partners to qualify cutting-edge US-centric semiconductor packaging solutions within the Arizona ecosystem.

“ASU is the new center of gravity of US semiconductor and packaging innovation, Coupled with the recent CHIPS investments and large-scale manufacturing builds from TSMC and Amkor, there is no better development partner for LQDX.

This agreement takes the research partnership we initiated in 2024 to the next level and is focused on the delivery of next generation IC-substrates and advanced semiconductor packaging solutions as enabled by our PVD-in-a-Bottle^TM technology”.

Simon McElrea, LQDX’ CEO.

Professor Hongbin Yu of Arizona State University stated “We are delighted to work with LQDX on the development and scaling of their advanced packaging technology at ASU. It is our vision to develop and scale cutting-edge semiconductor technologies that further the economic interests of the State of Arizona and the US as a whole, and we welcome LQDX to the AZ ecosystem.”

LQDX pioneers advanced materials for AI and high-performance computing applications, unlocking new possibilities for the semiconductor packaging industry. Founded in collaboration with the Stanford Research Institute (SRI), the company, based in Silicon Valley California, has developed a suite of cutting-edge chemistries and process technologies to revolutionize chip interconnect architecture. As the demand for computing power skyrockets with the rapid rise of AI and ML computing, new tools are needed in the semiconductor packaging and Ultra High-Density Interconnect (UHDI) toolbox. At the heart of LQDX’ portfolio lies LMI_x® – or Liquid Metal Ink technology – a novel metallization chemistry suite that enables the production of circuits up to 250 times denser than conventional Printed Circuit Boards (PCBs). These advanced features, previously exclusive to silicon, are essential to meet the exponential growth demand in signal density required by advanced chips and Chiplets. As an alternative to highly expensive wafer processing which uses Physical Vapor Deposition (PVD) technology, LMI_x® is simple PVD-in-a-Bottle^TM substitute that integrates seamlessly into existing infrastructure.