TSMC and Amkor Technology signed a 10-year agreement to expand advanced semiconductor packaging and testing in Arizona. The partnership will accelerate production of AI and high-performance computing chips while strengthening the U.S. semiconductor supply chain. Amkor will deliver advanced packaging and testing near TSMC’s Phoenix fabs, creating a more integrated domestic semiconductor manufacturing ecosystem.

Bailey Pemberton via Yahoo Finance:

TSMC (Taiwan Semiconductor Manufacturing Company Limited or Taiwan Semiconductor) is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world’s largest dedicated independent semiconductor foundry, and its country’s largest company, with headquarters and main operations located in Hsinchu, Taiwan. Although the central government of Taiwan is the largest individual shareholder, the majority of TSMC is owned by foreign investors. In 2023, TSMC served 528 business customers and manufactured 11,895 products for various applications covering a variety of end markets including high performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics.

Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services. It is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, automotive and industrial, computing, and consumer industries, including smartphones, electric vehicles, data centers, artificial intelligence, and wearables. Amkor’s operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe, and the United States.