Syenta, an Australian semiconductor technology company, today announced the opening of its first U.S. facility in Tempe, Arizona, bringing advanced packaging technology, high-skilled jobs, and global innovation to the state. The expansion was made possible with support from the Arizona Commerce Authority (ACA), Greater Phoenix Economic Council (GPEC), City of Tempe, and Arizona State University (ASU).

As AI systems push beyond traditional chip design limits, performance is increasingly constrained by advanced packaging, the density and efficiency of chip-to-chip interconnects. Syenta’s Localized Electrochemical Manufacturing (LEM) technology addresses this bottleneck. The company’s new Tempe facility positions it at the center of the U.S. semiconductor industry, where it will extend Syenta’s capability through commercial relationships with the customers, research institutions, talent, and partners driving next-generation AI computing.

“Tempe is a natural choice for our first U.S. operations,” said Jekaterina Viktorova, CEO and Founder of Syenta. “The city offers world-class talent, research collaboration, and an ecosystem that allows us to scale our advanced packaging technology in support of AI system performance worldwide. We’re excited to bring our innovation here to be closer to our customers and grow a talented, mission-driven team.”

Located at ASU Research Park, the new 3,500-square-foot facility will support 200 new highly-skilled roles in semiconductor engineering, systems architecture, and advanced manufacturing, positioning Tempe as a hub for next-generation advanced packaging technologies.

The site will serve as a demonstration and development hub for Syenta’s proprietary Localized Electrochemical Manufacturing (LEM) technology, with a focus on enabling high-resolution interconnects for advanced semiconductor packaging.

The facility will also support advancement of the Achyon LEM platform and provide a space to engage closely with semiconductor partners and investors on next-generation AI infrastructure solutions.

Arizona has become a leading destination for semiconductor development. The city’s robust innovation ecosystem, access to top talent, and research partnerships—including ASU’s Research Park—made Tempe an ideal location for Syenta’s U.S. expansion.

“Syenta’s decision to launch its U.S. operations in Tempe reinforces Arizona’s position as North America’s most advanced and competitive semiconductor ecosystem,” said Sandra Watson, President and CEO of the Arizona Commerce Authority. “This new facility strengthens a critical part of the supply chain and accelerates next‑generation packaging innovation right here in Arizona.”

“Located in the center of America’s semiconductor onshoring, Syenta will work closely with Arizona State University to scale its U.S. operations and contribute to a vital component of the supply chain,” said Christine Mackay, President and CEO, Greater Phoenix Economic Council. “Greater Phoenix’s burgeoning relationship with Australia is expanding our global vitality and technological capabilities, and we’re excited to welcome Syenta to Tempe.”

“Tempe is where innovators thrive, and we’re thrilled to welcome Syenta into our community,” said Tempe Mayor Corey Woods. “By choosing our city for its first U.S. facility, Syenta is tapping into one of our region’s strongest ecosystems for semiconductor engineering and advanced manufacturing. We’re excited to support Syenta’s groundbreaking work and look forward to the impact its continued innovation will have in advancing the semiconductor industry and strengthening our local economy with new high-skilled jobs.”

“Syenta and ASU share a commitment to innovation and uncovering solutions that will accelerate discovery,” said ASU Executive Director of Economic Development Neil Calfee. “By co-locating at the ASU Research Park, Syenta will work with ASU to leverage faculty expertise and state-of-the-art facilities for the next generation of AI technology, and together with ACA and GPEC, we can continue to elevate Arizona as the epicenter of semiconductor manufacturing.”

Expanding Advanced Packaging Capabilities

Syenta has developed Localized Electrochemical Manufacturing (LEM), a breakthrough technology enabling existing packaging infrastructure to achieve interconnect densities previously only possible on silicon in high end foundries. LEM has already achieved interconnect resolutions of 1-micron, with a roadmap for sub-micron features, allowing even greater system bandwidth, scalability, and efficiency for AI and high-performance computing.

“Advanced packaging has become one of the most significant bottlenecks in scaling next-generation computing,” said Pat Gelsinger, former CEO of Intel and General Partner at Playground Global who has recently joined Syenta’s board after the VC firm led their Series A1 round. “Syenta’s technology expands manufacturing capacity, strengthens supply chain resilience, and enables broader competition in the semiconductor ecosystem.”

Global Momentum and Ongoing Growth

While the Arizona expansion is anchored by ACA support, Syenta is also experiencing global growth momentum. Recently, the company announced $26 million in Series A1 funding, led by Playground Global and Australia’s National Reconstruction Fund (NRF), to expand advanced packaging capacity and strengthen global supply chains. Pat Gelsinger joined the company’s board as part of this investment.

“While our U.S. facility anchors Syenta in Arizona, our global funding ensures we can scale our technology and meet growing demand across international markets,” said Jekaterina Viktorova.

Growing the Team

With operations spanning Australia and the United States, Syenta is actively hiring for roles in process and applications engineering.

“We are building a team that is motivated by playing a role in the next frontier of semiconductor manufacturing technology,” said Jekaterina Viktorova. “Every employee contributes directly to the goal of enabling a more efficient chip architecture and manufacturing method for building advanced packaging. We invite talented professionals to join us in Tempe or Sydney.”